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¸ÅÒª£ºResume number: 484991702 Updating date: 2012-10-29 13:34:06 no photo Name: Mr. linpeng Nationality: China (Mainland) Current Place: Zhongshan Height/Weight: 168 cm£ 63 kg Marital Status: Single Age: 29 years Career Objective Application type: Jobseeker Preferred job title: Others: PM ¡¢

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Resume number: 484991702 Updating date: 2012-10-29 13:34:06 no photo Name: Mr. linpeng Nationality: China (Mainland) Current Place: Zhongshan Height/Weight: 168 cm£ 63 kg Marital Status: Single Age: 29 years Career Objective Application type: Jobseeker Preferred job title: Others: PM ¡¢ Sales Engineer: ¡¢ Pre-sales/After-sales Technical Support Engineer: Working life: 5 Title: Senior title Job type: Full time Expected Start date: In a week Expected salary: £¤8,000--£¤12,000 Preferred working place: Guangzhou Shenzhen Zhuhai Work experience Company's name:Ambit (Foxconn)Begin and end date: 2004-08-2012-07Enterprise nature:Soly foreign funded enterprisesIndustry: Communication/Telecom/Network EquipmentJob Title: Thick film new product leaderJob description: Team leader
1.During 2004~2005,I am mainly responsible for RF new product introduce and success in transferring Freescale¡¯s Yellow into mass production.
2.During 2005~20xx,I am mainly responsible for thick-film transfer project and success in transferring the substrate assembly from Taiwan to ZhongShan.
3.During 2005~2012, I am mainly responsible for thick-film new product (Acousticon microphone) introduce and success in transferring several main products into mass production, such as EM, FG, TO series.
4.During 20xx~20xx, success in replacing dispensing epoxy to printing epoxy and reducing 4/5 work hours.
5.During 20xx~20xx, success in replacing AT to PT and reducing 4/5 work hours.
Six Sigma project
1.20xx~20xx,improved the circuit PFA yield from 60% to 99%.
2.20xx~20xx,reduced scrap and improved thick-film product overall yield from 94% to 98%.
3.20xx~2012,improved the usage of substrate form 45% to 75%.Reasons for leaving: Educational Background Name of School: Wuhan University of Science and Technology Highest Degree: Bachelor Date of Graduation: 2004-07-01 Name of Major 1: mechanical engineering and automation Name of Major 2: Education experience: Start dateEnd dateEducation organizationMajorsCertificateCertificate No2000-092004-07Wuhan University of Science and Technologymechanical engineering and automationbachelor1048840401118 Language Ability Foreign Language: English Level: good Chinese level: normal Cantonese Level: normal Relevant skills and abilities After graduating I work for Ambit (Foxconn), the current job is the thick film
department of new product project leader, responsible for a major new product process as follows:
Circuit Assembly (wafer dicing, flip chip, reflow, dispensing, testing, Circuit
sawing),
Substrate Assembly (printing, firing, resistor laser trim, testing).
5-years thick film product development, integrated circuit chip package assembly work experience, familiar with the RF package production process. Particularly in the following jobs has accumulated a wealth of practical experience:
1.Be familiar with substrate printing screen/stencil design and modification.
2.Be skilled in evaluation and selection of substrate assembly (conductor/resistor/dielectric paste, ceramic substrate, and clean solvent) and circuit assembly (solder paste, flux, under hill, blade, and clean solvent).
3.Be skilled in customer drawing review and modification, gap analyzes report provided.
4.Be good at planning new projects, gathering resources and coordination, setting up BOMs, product pricing, tooling design, introduction into mass production and relevant system documents like MFG, SOP, etc.
5.Be good at DOE to carry out experimental design and using Minitab to analyze the experiment.
6.Be good at SPC system, like7QC, FMEA, Control plan and Control MSA.
7.Deeply understand team management and process improvement, like TQM and cost down.
8.Proficient in Office tools, such as Excel, Word, PowerPoint, Notes, etc.
9.Proficient in Auto CAD, CAM350 and GC-GAM. Be capable to analyze and improve the structure and function of products by using these engineering applications. Self-recommendation letter Five years experienced in new product introduce and project management in a world-class corporation. Be positive, creative and willing to work as a team. Have strong independent problem-solving and communication skills, and be capable to help customers to solve the problem quickly to meet customer requirements.

Hope to make full use of 5 years in the semiconductor company development of new products, and customer coordination and communication experience for your company.